With the driving assistance system becoming more and more popular and the on-board information system becoming more and more complex, the bandwidth demand of the on-board network is also increasing. At the same time, the Ethernet circuit used to control the driving assistance system is also becoming more and more complex. The heat dissipation demand of the related products assembled in the car is also increasing, and the heat needs to be transferred from the chip end to the environment in time, otherwise the related electronic components will be damaged due to the high temperature.
The main technology of the board is to evenly coat the heat dissipation material on the PCB, so that the electronic components can timely dissipate the heat through heat conduction when working, and assist with other heat dissipation methods, so that the high-power components can work normally.